Quantification of the adhesive coupling of layered materials with guided ultrasonic waves (vor Ort)

* Presenting author
Day / Time: 22.03.2022, 14:40-15:00
Room: 57-04
Typ: Regulärer Vortrag
Session: Ultraschall
Online-access: Bitte loggen Sie sich ein, damit weitere Inhalte sichtbar werden (bspw. der Zugang zur Onlinesitzung).
Abstract: Adhesive bonds have clear advantages over conventional methods and ensure high-performance of structures, especially in lightweight construction such as in automotive and aerospace industries. Unfortunately, destructive methods are still widely used for testing of these joints. In this contribution, a new and possibly more advantageous non-destructive method is presented which investigates the strength of the adhesive interface layer by means of guided ultrasonic waves. For this purpose, so-called mode repulsion regions (MRRs) are used, which represent interesting properties in dispersion curves of layered materials.The dispersion curves of layered materials are calculated using the Scaled Boundary Finite Element Method (SBFEM). The Young’s modulus of the adhesive interface layer is chosen as a parameter representing the coupling strength. The averaged curvature of the repulsive modes of all MRRs in a certain frequency-wavenumber region is used as an evaluation parameter for coupling strength. For weakly coupled plates, the curvature is high and decreases steadily with increasing interface layer stiffness. The evaluation of the properties of MRR shows promising results, which could be used for non-destructive testing of adhesive joints.